Information Density: STATS ChipPAC – Signal Evidence & AI Readability

[H1] Connecting Technologies
Advanced IC back-end manufacturing for a smarter world.
[H1] Global Microsystems Integration Leader
[H3] 30+
years of semiconductor backend manufacturing expertise
[H3] 20+
operational locations worldwide
[H3] Your Trusted Partner for a More Interconnected Future
STATS ChipPAC is the world’s leading integrated circuit manufacturing and technology services provider. We offer a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probing, wafer bumping, package assembly, final testing, and drop shipment to vendors around the world.Learn More
[H1] Applications
Advanced packaging designed for the systems shaping tomorrow:
[H4] Power & Energy
[H4] Automotive
[H4] Computing
[H4] Memory
[H4] AI Edge
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[H1] Future-ProofTechnologies
Pioneering next-generation technologies to address tomorrow's challengesLearn More
[H1] Future-ProofTechnologies
Built to keep the world running smarter and faster.Learn More
[H1] Turnkey Microsystems Solutions
STATS ChipPAC offers end-to-end microsystem solutions, from design to test. With expertise in RF SiP design, wafer-level processing, and system-level testing, we provide product-tailored solutions that minimize time-to-market and ensure optimal performance for diverse applications.
[H4] Turnkey Services
[H4] Design Characterization
[H4] Wafer Bumping
[H4] Packaging
[H4] Testing
[H4] Reliability Testing &Failure Analysis
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[H1] Our Commitment to Planet, People, and Principles
Building a smarter, more sustainable future through measurable goals and responsible innovation.Learn More
[H4] Environmental Goals
Achieving net-zero emissions by 2050, with milestones including 90% renewable energy use by 2030 and <1% landfill rates by 2024.
[H4] Social Responsibility
Certified by RBA VAP, we prioritise health, safety, and ethical practices.
[H4] Governance Excellence
ISO14064-1 and ISO45001 certifications reflect our commitment to transparency and accountability in all operations.
[H1] Latest Stories
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[H4] Explore all stories
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[H1] Careers at STATS ChipPAC
With roles across multiple disciplines, we empower our employees to thrive in a collaborative environment. We value diverse perspectives and offer our employees the chance to contribute to projects that impact industries worldwide.Learn More

Wirebond PackagingReliable, cost-effective interconnects trusted in high-volume manufacturing.Flip Chip PackagingHigh-density, high-performance interconnects for advanced miniaturization.Wafer BumpingFoundational process technology for high-yield advanced packaging.Wafer Level PackagingAdvanced performance in ultra-compact form factors.System-in-Package High-density integration without trade-offs in performance or footprint.MEMS & Sensors PackagingCompact, integrated packaging for intelligent sensing and control.2.5/3D PackagingHigher density, better performance, and more efficient integration.Wirebond Packagingtechnology-wirebond-packagingWirebonding remains one of the most widely adopted methods in semiconductor assembly, connecting chips to substrates, substrates to substrates, or substrates to packages. We offer a full range of wirebond solutions across QFN, DFN, QFP, WB-BGA, and WB-LGA formats — with materials including gold, copper, silver, and palladium-coated wire. Backed by high-volume manufacturing and billions of units shipped, our platforms serve power, memory, MEMS, mobile, automotive, and beyond.Flip Chip Packagingflip-chip-packagingFlip chip technology enables direct die-to-substrate connections through solder bumps — reducing parasitics, improving thermal efficiency, and shrinking form factors.‍We support a broad range of flip chip formats including fcCSP, fcBGA, C2W, and 3DIC. Applications span from large single-die packages with thermal enhancements to compact modules and AiP designs with embedded antennas.Wafer Bumpingwafer-bumpingWafer bumping enables high-density interconnects directly at the wafer level. It supports improved electrical performance, tighter form factors, and lower overall cost.‍We provide bumping and redistribution services for 200mm and 300mm wafers, including redistribution and full turnkey support for flip chip and wafer-level packaging. Our process capabilities span printed bump, ball drop, and plated bumping with lead-free and copper pillar alloys—optimized for reliability and production scale.‍Wafer Level Packagingwafer-level-packagingWafer-level packaging integrates more functionality directly at the wafer stage, reducing size and improving power, speed, and signal integrity. It’s key to enabling next-gen devices that demand performance without compromising footprint or cost. System-in-Packagesystem-in-packageSystem-in-Package (SiP) combines multiple chips and components into a single compact module, enabling faster processing, higher performance, and more functionality in less space.‍Our platforms support heterogeneous integration of logic, analog, power, and memory ICs using SMT, wirebond, and flip chip. Advanced technologies include:Dual-sided molding – reduces package size, shortens routing, lowers resistance, and improves system performanceEMI shielding – enhances thermal conductivity and signal integrity via backside metallizationLaser-assisted bonding (LAB) – overcomes traditional reflow issues like warpage, stress, and CTE mismatch for improved reliability‍MEMS & Sensors Packagingmems-sensors-packagingMEMS and sensor packaging enables real-time sensing, responsiveness, and control in compact, power-efficient designs. These technologies are foundational across communications, automotive, medical, industrial, and consumer systems.‍Our dedicated MEMS team supports full turnkey development including packaging co-design, simulation, BOM qualification, assembly, testing, and quality assurance. We deliver highly integrated, size-optimized solutions that meet the performance and cost demands of modern sensing applications.‍2.5/3D Packaging2-5-3d-packagingAdvanced 2.5D and 3D packaging stacks and interconnects multiple components to maximize functionality and performance.‍

[H1] Environmental Health & Safety
Our initiatives focus on minimising risks, promoting employee well-being, and adhering to environmental regulations.
[H1] Protecting our people with safety-first policies.
Comprehensive training and workplace safeguards ensure a secure and healthy environment for employees.
[H1] Cleaner production for a greener future.
We prioritize energy efficiency, waste reduction, and pollution prevention to reduce our environmental footprint.
[H1] Ethical operations, continuous progress.
Our commitment to integrity drives compliance, innovation, and sustainable development.

[H1] Contact Us
[H2] International Sales Network
[H3] Global HQ | Singapore
509 Yishun Industrial Park ASingapore 768735‍Phone: (+65) 6233-8899Email: contact@statschippac.com
[H3] SCS | Singapore
5 Yishun Street 23Singapore 768442‍Phone: (+65) 6824-7888Email: contact@statschippac.com
[H3] SCI | United States
880 N McCarthy Blvd., Suite 250Milpitas, CA 95035‍Phone: (+1) 510-979-8000Email: contact@statschippac.com‍
[H3] SCK | South Korea
191 Jayumuyeok-ro, Jung-guIncheon 22379‍Phone: (+82) 032-340-3114Email: contact@statschippac.com
[H3] SCE | Switzerland
Chemin du Vuasset 21028 Préverenges‍Phone: (+41) 21-804-7200Email: contact@statschippac.com
[H2] Corporate Relations
[H3] PR & Media
For media inquiries, interviews, or event requests:communications@statschippac.com
[H3] Supply Chain
For supply chain-related inquiries or partnerships:supplychain@statschippac.com
[H3] Compliance
For grievances or non-compliance in our operations, please contact:compliance@statschippac.comReports can be made anonymously, and no retaliation will occur for reporting in good faith.
[H2] Connect With Us
Get in touch to discover how we can drive innovation and success for your business.Thank you! Your submission has been received!Oops! Something went wrong while submitting the form.